all member here..enjoy to learn more motorola hardware repair procedures!that is good solution.
Underfill Rework Process
Open/peel off the shield cover, put the board on the repair fixture, use hot gun to heat the BGA, remove BGA when the solder melted.
Apply flux to the pads of the board, and clean the BGA area with electric iron!
Repair_Soldering_Procedures
Download-Link #1:
http://rapidshare.com/files/106886211/Repair_-_Soldering_Procedures.rar
